CA20 - Submicron 3D X-ray for Advanced Packaging
Designed to provide excellent 2D and 3D images at the highest resolution! Capable of inspecting micron-sized details at high speed! *Exhibited at NEPCON Japan.
The semiconductor sector is an industry that demands speed. In the competition for technological innovation, every day counts. As an inspection system specifically developed to address the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps customers maintain their pace and stay at the forefront of competition. The CA20 enables accelerated validation of new packaging process node prototypes. The faster you identify and resolve the root causes of issues during ramp-up, the sooner you can achieve the desired yield and, consequently, return on investment (ROI). 【Features】 ■ Designed for the semiconductor industry ■ Non-destructive technology that captures solder bumps in three dimensions within minutes ■ High reproducibility results from reliable and accurate technology designed to support stable inspection routines ■ Efficient software-assisted review including automatic void analysis with Void Insights ■ Dose Manager to protect components sensitive to X-ray exposure *For more details, please download the PDF or feel free to contact us.
- Company：Comet Technologies Japan K.K. Comet Yxlon
- Price：Other
